阿普奇頂部AI平臺TAC-3000是一款更適(shi)用(yong)于邊(bian)(bian)(bian)緣(yuan)(yuan)計(ji)算(suan)(suan)(suan)領域的(de)嵌入(ru)(ru)式(shi)工(gong)(gong)控(kong)(kong)機(ji),具備強大(da)的(de)計(ji)算(suan)(suan)(suan)能(neng)力和(he)豐富的(de)功(gong)能(neng)特點。嵌入(ru)(ru)式(shi)工(gong)(gong)控(kong)(kong)機(ji)TAC-3000采(cai)用(yong)高(gao)(gao)性(xing)能(neng)AI控(kong)(kong)制器,算(suan)(suan)(suan)力高(gao)(gao)達100TOPS,可快(kuai)速處(chu)理復雜的(de)AI算(suan)(suan)(suan)法和(he)大(da)量(liang)數(shu)據,確(que)保(bao)邊(bian)(bian)(bian)緣(yuan)(yuan)計(ji)算(suan)(suan)(suan)的(de)效率(lv)和(he)準(zhun)確(que)性(xing)。支持(chi)NVIDIA Jetson TMS O-DIMM連(lian)接(jie)(jie)器核心(xin)板,提(ti)供高(gao)(gao)性(xing)能(neng)AI計(ji)算(suan)(suan)(suan)單元,滿(man)足各種(zhong)邊(bian)(bian)(bian)緣(yuan)(yuan)計(ji)算(suan)(suan)(suan)應(ying)用(yong)需(xu)(xu)求。嵌入(ru)(ru)式(shi)工(gong)(gong)控(kong)(kong)機(ji)TAC-3000還具有豐富的(de)擴(kuo)展接(jie)(jie)口(kou),包括3個千兆(zhao)網絡接(jie)(jie)口(kou)、4個USB 3.0接(jie)(jie)口(kou)以(yi)及可選的(de)16位DIO和(he)2個RS232/RS485 COM接(jie)(jie)口(kou),適(shi)應(ying)各種(zhong)不同的(de)邊(bian)(bian)(bian)緣(yuan)(yuan)計(ji)算(suan)(suan)(suan)應(ying)用(yong)需(xu)(xu)求。支持(chi)5G/4G/WiFi功(gong)能(neng)擴(kuo)展,具備強大(da)的(de)無線通信能(neng)力,實現(xian)高(gao)(gao)速數(shu)據交互(hu)。同時采(cai)取無換(huan)氣(qi)扇超(chao)緊奏型開(kai)發,全金屬(shu)鍛造(zao)度主機(ji),使(shi)(shi)用(yong)手(shou)機(ji)桌面式(shi)和(he)DIN安裝方式(shi),方便部署和(he)使(shi)(shi)用(yong)。提(ti)供穩(wen)定的(de)DC 12~28V寬壓輸入(ru)(ru),確(que)保(bao)在各種(zhong)工(gong)(gong)作條(tiao)件下(xia)穩(wen)定運(yun)行,滿(man)足高(gao)(gao)負載邊(bian)(bian)(bian)緣(yuan)(yuan)計(ji)算(suan)(suan)(suan)場(chang)景需(xu)(xu)求。
總的來說,阿普奇內嵌式工控設備機TAC-3000借助厲害的算性能、豐厚的延伸插孔、穩定性的電原產生、厲害的無線路由通信能力性能各類靈便的實施原則等特色,充分滿足近現代表面算利用使用需求。可比較適合各式表面算的場景,推進表面算能力的的發展和利用。
Model |
TAC-3000 |
||||
Processor System |
SOM |
Nano |
TX2 NX |
Xavier NX |
Xavier NX 16GB |
AI Performance |
472 GFLOPS |
1.33 TFLOPS |
21 TOPS |
||
GPU |
128-core NVIDIA Maxwell??architecture GPU |
256-core NVIDIA Pascal??architecture GPU |
384-core NVIDIA Volta??architecture GPU with 48 Tensor Cores |
||
GPU Max Frequency |
921MHz |
1.3 GHz |
1100 MHz |
||
CPU |
Quad-core?ARM??Cortex?-A57?MPCore processor |
Dual-core?NVIDIA DenverTM?2?64-bit?CPU?and?quad-core?Arm??Cortex?-A57 MPCore processor |
6-core NVIDIA Carmel Arm? v8.2 64-bit CPU 6MB L2 + 4MB L3 |
||
CPU Max Frequency |
1.43GHz |
Denver 2: 2 GHz Cortex-A57: 2 GHz |
1.9 GHz |
||
Memory |
4GB?64-bit?LPDDR4 25.6GB/s |
4GB?128-bit?LPDDR4 51.2GB/s |
8GB?128-bit? LPDDR4x 59.7GB/s |
16GB?128-bit?LPDDR4x 59.7GB/s |
|
TDP |
5W-10W |
7.5W - 15W |
10W - 20W |
||
Processor System |
SOM |
Orin Nano 4GB |
Orin Nano 8GB |
Orin NX 8GB |
Orin NX 16GB |
AI Performance |
20 TOPS |
40 TOPS |
70 TOPS |
100 TOPS |
|
GPU |
512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores |
1024-core NVIDIA Ampere architecture GPU? with 32 Tensor Cores |
1024-core NVIDIA Ampere? architecture GPU ?with 32 Tensor Cores |
||
GPU Max Frequency |
625 MHz |
765 MHz |
918 MHz |
? |
|
CPU |
6-core Arm??Cortex??A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 |
6-core Arm?? Cortex??A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 |
8-core Arm?? Cortex?? A78AE v8.2 64-bit CPU?2MB L2 + 4MB L3 |
||
CPU Max Frequency |
1.5 GHz |
2 GHz |
|||
Memory |
4GB 64-bit LPDDR5 34 GB/s |
8GB 128-bit LPDDR5 68 GB/s |
8GB 128-bit LPDDR5 102.4 GB/s |
16GB 128-bit LPDDR5 102.4 GB/s |
|
TDP |
7W - 10W |
7W - 15W |
10W - 20W |
10W - 25W |
|
Ethernet |
Controller |
1 * GBE LAN Chip (LAN signal from System-on-Module), 10/100/1000 Mbps2 * Intel??I210-AT, 10/100/1000 Mbps | |||
Storage |
eMMC |
16GB eMMC 5.1 (Orin Nano and Orin NX SOMs do not support eMMC) | |||
M.2 |
1 * M.2 Key-M (NVMe SSD, 2280) (Orin Nano and Orin NX SOMs is PCIe x4 signal, while other SOMs is PCIe x1 signal) | ||||
TF Slot |
1 * TF Card Slot (Orin Nano and Orin NX SOMs do not support TF Card) | ||||
Expansion Slots |
Mini PCIe |
1 * Mini PCIe Slot (PCIe x1+USB 2.0, with 1 * Nano SIM Card) (Nano SOM do not have PCIe x1 signal) | |||
M.2 |
1 * M.2 Key-B Slot (USB 3.0, with 1 * Nano SIM Card, 3052) | ||||
Front I/O |
Ethernet |
2 * RJ45 | |||
USB |
4 * USB3.0 (Type-A) | ||||
Display |
1 * HDMI: Resolution up to 4K @ 60Hz | ||||
Button |
1 * Power Button + Power LED 1 * System Reset Button |
||||
Side I/O |
USB |
1 * USB 2.0 (Micro USB, OTG) | |||
Button |
1 * Recovery Button | ||||
Antenna |
4 * Antenna hole | ||||
SIM |
2 * Nano SIM | ||||
Internal I/O |
Serial |
2 * RS232/RS485 (COM1/2, wafer, Jumper Switch)1 * RS232/TTL (COM3, wafer, Jumper Switch) | |||
PWRBT |
1 * Power Button (wafer) | ||||
PWRLED |
1 * Power LED (wafer) | ||||
Audio |
1 * Audio (Line-Out + MIC, wafer)1 * Amplifier, 3-W (per channel) into a 4-Ω Loads (wafer) | ||||
GPIO |
1 * 16 bits DIO (8xDI and 8xDO, wafer) | ||||
CAN Bus |
1 * CAN (wafer) | ||||
FAN |
1 * CPU FAN (wafer) | ||||
Power Supply |
Type |
DC, AT | |||
Power Input Voltage |
12~28V DC | ||||
Connector |
Terminal block, 2Pin, P=5.00/5.08 | ||||
RTC Battery |
CR2032 Coin Cell | ||||
OS Support |
Linux |
Nano/TX2 NX/Xavier NX: JetPack 4.6.3Orin Nano/Orin NX: JetPack 5.3.1 | |||
Mechanical |
Enclosure Material |
Radiator: Aluminum alloy, Box: SGCC | |||
Dimensions |
150.7mm(L) * 144.5mm(W) * 45mm(H) | ||||
Mounting |
Desktop、DIN-rail | ||||
Environment |
Heat Dissipation System |
Fan less design | |||
Operating Temperature |
-20~60℃?with 0.7 m/s airflow | ||||
Storage Temperature |
-40~80℃ | ||||
Relative Humidity |
10 to 95% (non-condensing) | ||||
Vibration |
3Grms@5~500Hz, random, 1hr/axis (IEC 60068-2-64) | ||||
Shock |
10G, half sine, 11ms (IEC 60068-2-27) |
326--------m.svt516.com
265--------m.respectful-living.com
454--------m.totallyterroir.com
776--------m.488498.com
769--------m.htdgslb.com